Flex Capability


Flex &
Rigid Flex



Flex Capability

For Flex Capability, Material selection, process tolerances, manufacturing logistics, and your flex supplier all play an important role in producing a cost-effective circuit designing. Additionally, it is equally important for the maintenance of reliable flex circuit design.

At Rushpcb assembly will assist you in design for manufacturing to minimize overall program costs. Nevertheless, you can trust our services without a doubt. But, make it sure that you are sharing the complete detail and information.

Flex capability

Thus, Listed are standard materials and capabilities.

So, Come speak with us and tell us should your design require tighter tolerances or special process treatments.

  • Material Selection
  • Process Capabilities & Tolerances
 Polyimide Thickness0.0005″ (12 um), 0.001″ (25 um), 0.002″(50 um), 0.003″ (75 um), 0.005″ (125 um)
 Copper (thickness) 0.25 oz.(9 um),  0.33 oz.(12 um), 0.5 oz. (17 um),  1 oz.(35 um),  2 oz.(70 um)
 Copper Foils(rolled-annealed) Polyimide, Polyester, LPI (liquid photo imageable), PIC(photo imageable cover coat)
 Stiffeners FR-4, Polyimide, Metal, or customer supplied
 Thermo-bond Adhesives Acrylic, Phenolic Butyral, Modified Epoxy
 Surface Finishes Solder (hot air leveling or tin/lead plating), Electrolytic Soft Bondable Gold, Hard Gold, ENIG (electroless nickel immersion gold), Entek 106A, & Immersion Tin
 Minimum Trace/Space0.0015″/.002″ (0.33 oz.)
0.002″/.0025″ (0.5 oz.)
0.003″/.0035″ (1 oz.)
 Minimum Via Hole Diameter (before plating) 0.006″ (NC Drill)
0.002″ (UV Laser)
 Minimum Blind Via Diameter (before plating) 0.004″ (UV Laser)
 Trace to Edge Distance 0.010″ ( NC Route )
0.008″ (Die Punch)
0.001″ (UV Laser)*
 Trace to Edge Tolerance 0.005″ ( NC Route )
0.003″ (Die Punch)
0.001″ (UV Laser)
 Cover Layer Aperture Positional Tolerance 0.005″ (Cover Film)
0.002″ (LPI and PIC)
0.001″ (Laser Ablation)**

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