High Density Interconnect

High-Density Interconnects (HDI) are a fact of life in today’s miniaturized electronics assemblies, such as smart devices and tablets. Furthermore, HDI technology is incorporated into the basic fabrication of the PCB itself and the connections to the components.

The High-Density Interconnects (HDI) isn’t used just the connections between Printed Circuit Boards (PCBs), like the freeways connecting the cities. It’s in the fabrication of the PCB itself and the connections to the components, like the city streets and alleys between the dwellings and apartment buildings.

Surface Mount Technology (SMT) with its fine pitch components requires the printed circuit board miniaturization characteristics and benefits of HDI:

1. Tight tolerances
2. Densely spaced traces and pads
3. Multiple layers on a single PCB
4. Micro-vias to carry signals from one layer to another

HDI, with its attendant reduction in size and weight, goes hand in hand with this greater density of surface mount components. Of course, the high count connections for integrated circuits and components including BGAs and flip chips simply adds to the need for High-Density Interconnects (HDI).

The smaller size and weight of HDI circuitry means that the circuit boards fit into smaller spaces. Additionally, it shows that it has less mass than conventional printed circuit designs. Above all, the smaller size and weight also contributes to less chance of damage from mechanical shocks.

Placement of the components on the PCB requires more accuracy than conventional PCB design due to the smaller, more compact topography of the PCB.

BGAs and Flip Chips necessitate special soldering techniques and added steps in the assembly and rework (repair) process.

It is our immense pleasure to assist you with the engineering and design of your HDI PCBs.

For more information, contact us at sales@rushpcb.uk, or call us at 0203 750 0201.