PCB Production Capabilities
HDI
Capabilities
Flex &
Rigid Flex
Exotic
Materials
MFG
Capabilities
PCB Production Capabilities
Rush PCB Inc. offers unlimited PCB Prototype Fabrication and PCB Production Capabilities.
Do call us at 0203 750 0201 or get an instant PCB quote. Simply tell us what you need and we will provide you with the proper PCB production and assembly solution. We will work with you to turn your concepts into reality.
| Specifications | Standard Technology | Advanced Technology |
| Number of Layers | 1 – 12 | 14 – 40 |
| Board Material | FR4 | Aluminium Core |
| FR406 | Arion | |
| IS410 | CEM | |
| Kapton | Copper Core | |
| Shin-Etso – Epoxy Adhesive System | FR408 | |
| Rogers – Epoxy Adhesive System | GetekNelco 4000 | |
| Dupont FR – FR Acrylic Adhesive System | Rogers 3000Rogers 4000Rogers 5000 | |
| Dupont LF – LF Acrylic Adhesive System | Taconic TLY | |
| Adhesiveless Base Materials | Polyimide | |
| Minimum Board Thickness | 2 Layer – 0.010” | 2 Layer – 0.005” |
| 4 Layer – 0.020” | 4 Layer – 0.010” | |
| 6 Layer – 0.020” | 6 Layer – 0.031” | |
| 8 Layer – 0.062” | 8 Layer – 0.040” | |
| 10 Layer – 0.062” | ||
| 12 Layer – 0.062” | ||
| Maximum Board Thickness | 2 Layer – 0.125” | 0.250” |
| 3-12 Layer – 0.200” | ||
| Maximum Board Size | 16” x 22” | 10” x 16” |
| 12” x 21” | 16” x 22” | |
| 22” x 28” | 12” x 21” | |
| 22” x 28” | ||
| Copper Thickness | 0.5 Oz – 3 Oz | 4 Oz – 6 Oz |
| Hole Aspect Ratio | 7:1 | 15:1 |
| Minimum Hole Size | 0.008” | 0.006” |
| Minimum Trace/Space | 0.006”/0.006” | 0.003”/0.003” |
| Minimum Drill-to-Copper | 0.010” | 0.003” |
| Minimum Pitch | 1.0 mm | 0.03 mm |
| Finall Finish | HASL (Solder) | HASL |
| Lead Free Solder | Gold(ENIG/Hard/Soft) | |
| Copper | Selective Gold | |
| Gold | Immersion Silver | |
| Gold Fingers | OSP | |
| White Tin | White Tin | |
| OSP | ||
| Solder Mask | LPI: | LPI: |
| Green | Green | |
| Black | Black | |
| Red | Red | |
| Blue | Blue | |
| Yellow | Yellow | |
| White | White | |
| Clear | Clear | |
| Mix-and-match | ||
| Wet Mask | ||
| Dry Film | ||
| Coverlay | FR Coverlay | |
| LF Coverlay | ||
| Shin-Etsu | ||
| Flexible Soldermask | ||
| Silk Screen | White | White |
| Black | Black | |
| Yellow | Yellow | |
| Green | ||
| Red | ||
| Blue | ||
| PCB Fabrication | Scoring | Jump Scoring |
| Route & Retain | Route & Retain | |
| Milling | ||
| Additional Features | Plated Slots | Plated Edges |
| Non-Plated Slots | Plated Milling | |
| Controlled Dielectric | Plated Counter Bores | |
| Covered Vias | Plated Counter Sinks | |
| Counter Sinks | Edge Castellation | |
| Counter Bores | Controlled Impedance | |
| Dual Access Flex | Silver Filled Vias | |
| Suspended Leads | Non-Conductive Filled Vias | |
| Quality Standards | IPC 6012 Class2 | Milspec 31032 |
| Electrical Testing | Milspec 55110 | |
| 100% Netlist Testing | Milspec 50884 | |
| TDR Testing | IPC 6012 Class 3 | |
| 100% Netlist Testing | ||
| TDR Testing | ||
| Special Technology | Blind and Buried Vias | |
| Laser Drilled Vias | ||
| Mechanically Drilled Micro Vias | ||
| Metal Core Boards | ||
| Burn-in Boards | ||
| Rigid-Flex Boards | ||
| Flexible PCBs | ||
| Micro Circuits | ||
| RF PCB |
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