Technologies

PCB technologies define the manufacturing limits and process capabilities that determine how a printed circuit board can be designed and built. These capabilities include minimum trace width and spacing, drilled hole size, aspect ratio, annular ring, anti-pad, solder mask clearance, dielectric thickness, registration tolerance, routing accuracy, and via options. Together, these parameters help engineers understand what is possible in standard production and what requires more advanced fabrication control.

Standard PCB technology is typically suitable for conventional designs with moderate routing density and common fabrication requirements. Advanced PCB technology is more suitable for demanding applications where tighter spacing, smaller drilled holes, reduced annular rings, thinner dielectrics, finer solder mask definition, and higher aspect ratios are required. This distinction is especially useful when evaluating complex multilayer designs, high-density interconnect structures, and boards with space-constrained component placement.