Technologies
HDI
Capabilities
Flex &
Rigid Flex
Exotic
Materials
MFG
Capabilities
PCB Technologies
| Item | Standard | Advanced |
|---|---|---|
| Minimum Line/Spacing, Internal | 3/3 | 3/3 |
| Minimum Line/Spacing, External | 4/4 | 3/3 |
| Minimum Drilled Hole Size | 8 | 6 |
| Aspect Ratio (Thickness to Drill) | 10:1 | 15:1 |
| Annular Ring (Diameter over Drill) | 10 | 8 |
| Anti-pad (Diameter over Drill) | 20 | 16 |
| Plated Hole Tolerance | ±3 | ±2 |
| Minimum Dielectric Thickness | 3 | 2 |
| Maximum PCB Thickness (inches) | 0.200 | 0.250 |
| Thickness Tolerance (% of Thickness) | ±10 | ±7 |
| Maximum PCB Dimensions (inches) | 16.0 X 22.0 | 30.0 X 44.0 |
| Fabricated Dimensions – NC Routing | ±5 mils | ±3 mils |
| Layer-to-Layer Registration Tolerance | ±5 | ±3 |
| Solder Mask Clearance, Per Side | 2.0 mils | 1.5 mils |
| Blind/Buried Vias (All Types) | yes | yes |
| Via Fill (Conductive, Non-Conductive) | no | yes |
| Inner Layers | Standard | Advance |
|---|---|---|
| Minimum Core thickness | 3 mils | 2 mils |
| Minimum Line width | 4 mils | 3 mils (H Oz copper) |
| Minimum Spacing (Air gap) | 4 mils | 3 mils (H Oz copper) |
| Minimum pad size | Drill size+10 mils | Drill Size+7 mils |
| Minimum Anti Pad (planes) | Drill Size+20 mils | Drill Size+16 mils |
| Outer Layers | Standard | Advanced |
|---|---|---|
| Max. Finished Thickness | 0.200 | 0.250 |
| Thickness Tolerance | ±10% | ±5% |
| Max. Aspect Ratio | 10:1 | 12:1 |
| Min. Drill Size | 10 | 8 mils |
| Min. Line width | 4 mils | 3 mils |
| Min. Spacing (air gap) | 4 mils | 3 mils |
| Min. Solder mask clearance | 4 mils | 3 mils |
| Min. solder mask web thickness (mask between pads) | 4 mils | 3.4 mils |
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