Flex and Rigid Hybrid Board

HDI
Capabilities

Flex &
Rigid Flex

Exotic
Materials

MFG
Capabilities

Flex and Rigid Hybrid BoardFlex and Rigid Hybrid Board

Flex + Rigid Hybrid Board

FR4 & Polyimide Kapton Thick

FLEX_RIGID-FLEX

Flexible Board

Polyimide kapton

FLEX_RIGID-FLEX

Blind & Burried 1+FLEX+1 Laser drill

Material:
Flex:L2~L3 TU-768:L1~L0 L0~L4
Laser:L4~L0 laser via:0.006″
dielec tricthickness: 0.0035″~0.0045″
No VIPPO

Construction Materials

Material Type

PI thic:1~3mils
Coverlay thic:2mils Ink thic:0.5~0.9mils
Adhesive thic:1~2mils (Polyester)
Nonflow PP 47N 49N thic:2.5mils
Stiffener PI FR4 AL
Copper ED RA
EMI SF-PC5500 thic:0.6~0.8milsCu + adhesive thic:2.4mils

Blind vias

Copper windowing
Laser via
Copper plating
Coverlay/Soldermask
Fab.: CNC, Laser cutting
Stiffener

Flex Main Equipments

Precision hot-Air Oven

LDI

Laser cutting

Mass. Lam. For flex and cover lay

Material Aluminum & FLEX base

Material-
FR4-ISOLA370HR Aluminu flex

Capability

FLEX_RIGID-FLEX

FLEX_RIGID-FLEX

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