High Density Interconnection In Hole

HDI Technology in Hole

High Density Interconnection

Blind & Burried 9+2+9 Laser Drill

Market Trend vs. Technology Solution

HDI Process Flow

Main Process of Build – up Layer

Construction Materials

Comparison of Material

Comparison of Via Technologies

Comparison of Blind Via

Prepreg

RCC

Build-up for 2 + N + 2

Laser Via Quality

1+6+1 without buried, extend to 1+N+1

1+4+4+1 with buried via, extend to 1+N+N+1

2+4+2 laser via on laser via

2+4+2 Staggered via, extend to 2+N+2

Blind via Capability

4- Layer Core Receiving

I.V.H.(Inner Via Hole) Drilling

Electroless Copper Plating

Electro Plating

Inner Via Hole Plugging
( for thickness >= 60 mil )

I.V.H.Grinding
( for thickness >= 60 mil )

Dry Film Lamination

D.F. Exposure / Developing

Etching

D.F. Strip

Black Oxide Treatment

Prepreg Layup

Lamination

Dry Film Lamination

D.F. Exposure / Developing

Etching

D.F. Strip

Mechanical Drlling for TH

Laser Drlling for Blind Via

Desmear / Electroless Copper Plating

Electro Plating

Dry film, Exposure & DES

Solder Mask Printing

S/M Exposure / Developing

Surface Finish

Symbol Mask Printing

Inspection