High Density Interconnection In Hole

HDI
Capabilities

Flex &
Rigid Flex

Exotic
Materials

MFG
Capabilities

RUSH PCB

HDI Technology in Hole

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High Density Interconnection


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Blind & Burried 9+2+9 Laser Drill


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Market Trend vs. Technology Solution


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HDI Process Flow


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Main Process of Build – up Layer


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Construction Materials


  Material Type

 

            FR 4 Tetra Function ( Tg. 130 – 140 ℃ )
  FR 4 High Tg ( Tg. 160 – 180 ℃ )
  RCC ( Tg. 150 ℃ & Tg. 185 ℃ )
  Ink ( VIL )

 

Comparison of Material


Prepreg
RCC
Low Cost
++
Strength
++
+
Hole wall roughness
+
Laminating control
+
Dielectric thickness
45um ~
30um ~ 80um
Smear residue on target pad
++
Dielectric constant
3.9 ~ 4.7
3.2 ~ 3.8
Shelf time
++
+
Working PNL size
++
+

Comparison of Via Technologies


Mechanical Drilling
Laser Drilling
Low Cost in Equipment
++
+
Low Cost in Production
+
++
Required Facilities
Drilling Machine
Laser Machine
Consumable
Drill Bits, Backup Board
None
Aspect Ratio
9
1
Via Size Capacity
200 um~
50~100um
Speed
140 H/min
20,000 H/min
Throughput
+

Comparison of Blind Via


Prepreg

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RCC

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Build-up for 2 + N + 2


Through Hole

Inner Laser Via

Stack Hole

Inner Via Hole

Surface Laser Via

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Laser Via Quality


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1+6+1 without buried, extend to 1+N+1


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1+4+4+1 with buried via, extend to 1+N+N+1


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2+4+2 laser via on laser via


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2+4+2 Staggered via, extend to 2+N+2


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Blind via Capability


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4- Layer Core Receiving


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I.V.H.(Inner Via Hole) Drilling


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Electroless Copper Plating


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Electro Plating


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Inner Via Hole Plugging
( for thickness >= 60 mil )


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I.V.H.Grinding
( for thickness >= 60 mil )


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Dry Film Lamination


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D.F. Exposure / Developing


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Etching


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D.F. Strip


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Black Oxide Treatment


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Prepreg Layup


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Lamination


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Dry Film Lamination


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D.F. Exposure / Developing


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Etching


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D.F. Strip


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Mechanical Drlling for TH


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Laser Drlling for Blind Via


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Desmear / Electroless Copper Plating


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Electro Plating


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Dry film, Exposure & DES


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Solder Mask Printing


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S/M Exposure / Developing


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Surface Finish


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Symbol Mask Printing


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Inspection


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