High Density Interconnection
Blind & Burried 9+2+9 Laser Drill
Market Trend vs. Technology Solution
Main Process of Build – up Layer
Comparison of Material
Dielectric thickness
45um ~
30um ~ 80um
Smear residue on target pad
–
++
Dielectric constant
3.9 ~ 4.7
3.2 ~ 3.8
Comparison of Via Technologies
Mechanical Drilling
Laser Drilling
Low Cost in Equipment
++
+
Low Cost in Production
+
++
Required Facilities
Drilling Machine
Laser Machine
Consumable
Drill Bits, Backup Board
None
Via Size Capacity
200 um~
50~100um
Speed
140 H/min
20,000 H/min
1+6+1 without buried, extend to 1+N+1
1+4+4+1 with buried via, extend to 1+N+N+1
2+4+2 laser via on laser via
2+4+2 Staggered via, extend to 2+N+2
I.V.H.(Inner Via Hole) Drilling
Electroless Copper Plating
Inner Via Hole Plugging
( for thickness >= 60 mil )
I.V.H.Grinding
( for thickness >= 60 mil )
D.F. Exposure / Developing
D.F. Exposure / Developing
Mechanical Drlling for TH
Laser Drlling for Blind Via
Desmear / Electroless Copper Plating
S/M Exposure / Developing