High Density Interconnection In Hole
HDI
Capabilities
Flex &
Rigid Flex
Exotic
Materials
MFG
Capabilities
HDI Technology in Hole

High Density Interconnection






Blind & Burried 9+2+9 Laser Drill



Market Trend vs. Technology Solution
HDI Process Flow

Main Process of Build – up Layer

Construction Materials
Material Type




Comparison of Material
Prepreg
RCC
Low Cost
++
–
Strength
++
+
Hole wall roughness
–
+
Laminating control
+
–
Dielectric thickness
45um ~
30um ~ 80um
Smear residue on target pad
–
++
Dielectric constant
3.9 ~ 4.7
3.2 ~ 3.8
Shelf time
++
+
Working PNL size
++
+
Comparison of Via Technologies
Mechanical Drilling
Laser Drilling
Low Cost in Equipment
++
+
Low Cost in Production
+
++
Required Facilities
Drilling Machine
Laser Machine
Consumable
Drill Bits, Backup Board
None
Aspect Ratio
9
1
Via Size Capacity
200 um~
50~100um
Speed
140 H/min
20,000 H/min
Throughput
–
+
Comparison of Blind Via
Prepreg
RCC
Build-up for 2 + N + 2
Through Hole
Inner Laser Via
Stack Hole
Inner Via Hole
Surface Laser Via

Laser Via Quality

1+6+1 without buried, extend to 1+N+1

1+4+4+1 with buried via, extend to 1+N+N+1

2+4+2 laser via on laser via

2+4+2 Staggered via, extend to 2+N+2

Blind via Capability

4- Layer Core Receiving

I.V.H.(Inner Via Hole) Drilling

Electroless Copper Plating

Electro Plating

Inner Via Hole Plugging
( for thickness >= 60 mil )

I.V.H.Grinding
( for thickness >= 60 mil )

Dry Film Lamination

D.F. Exposure / Developing

Etching

D.F. Strip

Black Oxide Treatment

Prepreg Layup

Lamination

Dry Film Lamination

D.F. Exposure / Developing

Etching

D.F. Strip

Mechanical Drlling for TH

Laser Drlling for Blind Via

Desmear / Electroless Copper Plating

Electro Plating

Dry film, Exposure & DES

Solder Mask Printing

S/M Exposure / Developing

Surface Finish

Symbol Mask Printing

Inspection

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