High Density Interconnection In Hole
HDI
Capabilities
Flex &
Rigid Flex
Exotic
Materials
MFG
Capabilities
HDI Technology in Hole
High Density Interconnection
Blind & Burried 9+2+9 Laser Drill
Market Trend vs. Technology Solution
HDI Process Flow
Main Process of Build – up Layer
Construction Materials
Material Type
FR 4 Tetra Function ( Tg. 130 – 140 ℃ )
FR 4 High Tg ( Tg. 160 – 180 ℃ )
RCC ( Tg. 150 ℃ & Tg. 185 ℃ )
Ink ( VIL )
Comparison of Material
Prepreg
RCC
Low Cost
++
–
Strength
++
+
Hole wall roughness
–
+
Laminating control
+
–
Dielectric thickness
45um ~
30um ~ 80um
Smear residue on target pad
–
++
Dielectric constant
3.9 ~ 4.7
3.2 ~ 3.8
Shelf time
++
+
Working PNL size
++
+
Comparison of Via Technologies
Mechanical Drilling
Laser Drilling
Low Cost in Equipment
++
+
Low Cost in Production
+
++
Required Facilities
Drilling Machine
Laser Machine
Consumable
Drill Bits, Backup Board
None
Aspect Ratio
9
1
Via Size Capacity
200 um~
50~100um
Speed
140 H/min
20,000 H/min
Throughput
–
+
Comparison of Blind Via
Prepreg
RCC
Build-up for 2 + N + 2
Through Hole
Inner Laser Via
Stack Hole
Inner Via Hole
Surface Laser Via
Laser Via Quality
1+6+1 without buried, extend to 1+N+1
1+4+4+1 with buried via, extend to 1+N+N+1
2+4+2 laser via on laser via
2+4+2 Staggered via, extend to 2+N+2
Blind via Capability
4- Layer Core Receiving
I.V.H.(Inner Via Hole) Drilling
Electroless Copper Plating
Electro Plating
Inner Via Hole Plugging
( for thickness >= 60 mil )
I.V.H.Grinding
( for thickness >= 60 mil )
Dry Film Lamination
D.F. Exposure / Developing
Etching
D.F. Strip
Black Oxide Treatment
Prepreg Layup
Lamination
Dry Film Lamination
D.F. Exposure / Developing
Etching
D.F. Strip
Mechanical Drlling for TH
Laser Drlling for Blind Via
Desmear / Electroless Copper Plating
Electro Plating
Dry film, Exposure & DES
Solder Mask Printing
S/M Exposure / Developing
Surface Finish
Symbol Mask Printing
Inspection
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