Printed Circuit Boards For Surface mount Tech

Surface Mount Technology (SMT) is a technique used for producing electronic circuits where components are mounted directly on the surfaces of the Printed Circuit Boards (PCBs). The resultant electronic device is called Surface Mount Device (SMD). Previously, the through-hole technology where components are fitted with wire leads into the circuit board’s holes was used for the construction of PCBs and other electronic devices but was later replaced by the SMT. Surface Mount Technology has the merit of being applicable to all types and sizes of components with leads or no leads. Moreover, the SMT technique is cheaper than the thru-hole technology (THT). PCB Surface Mount Technology has grown over the past few years with such boards finding numerous applications in the industrial, medical, commercial, transportation, environmental and consumer products fields.

We at RUSHPCB produce every type of SMT Printed Circuit Boards no matter what the application could be. Our services are flexible and our team of experts is committed to ensure that customer needs are satisfied. We have a reputation to prove it. Please visit us at and learn more about our range of products and services. You can also place a quote today and our team of experts will begin working on it immediately.

Why use PCBs for Surface Mount Technology?

Mass production of Printed Circuit Boards has to be done inan extremely mechanized manner so as to reduce the manufacturing costs. Traditional leaded PCBs and other electronic components cannot be applied in this approach thus the need for SMTs since component leads can be pre-formed. Comparatively, after the leads were automatically inserted into boards, problems would be encountered since wires could not fit properly thus slowing the production rates.

Different from that, many designers were of the idea that wires which were traditionally used for connections were not relevant to the construction and fabrication of Printed Circuit Boards. It is, because of this reason that components were soldered onto pads on the PCB instead of having leads placed through holes hence the Surface Mount Technology. In the same token, this eliminated the need for creating lead holes in the boards which increased the cost of production of rare PCBs.

Different from that, to accommodate SMT, a new set of components were needed. To do this, the electronic PCB designers came up with new outlines which could oversee the application of the same components on the SMTs. Join us as we discuss some of the major Surface Mount Technology components used for Printed Circuit Boards. We produce SMT PCBs with the quality and the characteristics of the resultant board depending on your specifications. If you need a perfect SMT Printed Circuit Board, please do not hesitate to pay us a visit at and enjoy being served by professionals in the PCB world.

Major SMT components

Surface Mount Technology components vary depending on the applications of the Printed Circuit Board. These categories shall be discussed in detail below.

  • Passive Surface Mount Devices

There is a variety of various packages used for the passive SMDs. However, most of the passive SMDs employed in the PCBs for SMT are either capacitors or resistors with the quantity and rating of the components used depending on the application of the PCB. Equally significant, other SMD devices used for the Surface Mount Technology are crystals, coils any other equipment specified by the customer. Common designations of capacitors and resistors are 1812, 1206, 0805, 0603, 0403 and 0201 (dimensions are in hundreds of an inch). The connection of passive SMDs to the PCBs are made using metallized areas at either end of the PCB.

  • Transistors and diodes

These components are mainly contained in small plastic packages with the connections being made via leads emanating from the package and a bend to touch the boards.  The use of 3 leads is most common since the device positioning and mounting can be easily determined.

  • Integrated circuits

The variety of packages used for ICs (Integrated Circuits) varies depending on the interconnectivity levels needed. However, many chips such as the simple logic chips require the 16 or 14 pins whereas other types of chips like the VLSI processors or associated require over 200 pins.  For small chips, packages like SOIC (Small Outline Integrated Circuit) are used. Such packages are the SMT version of the Dual In Line (DIL) packages commonly used for the 74 series logic chips. As if that is not enough, smaller versions like the Thin Small Outline Package (TSOP) and Shrink Small Outline Package (SSOP)are also used in the market. However, VLSI chips demand an entirely different approach and mainly uses the quad flat pack. This is a rectangular or a square footprint with pin emanating from all the 4 sides. The pins are bent out of the package (gull—wing information) to meet the board.

In the same token, an entirely different package available for the Integrated Circuits are the Ball Grid Array (BGA) where the connections are not made on the package’s side but instead they are placed underneath. The connection pads have solder balls which melt during the soldering process thus making a good connection with the boards.

As professionals in PCB manufacturing, assembly, fabrication and design, our prices are very fair and we assure our customers of quality, uniqueness and efficiency while designing their boards. We also manufacture Surface Mount Technology or any other type of PCB ranging from RoHS and leaded PCBs depending on your specifications. In the event that you are not decided on the best type of PCB to use our sales representatives will advise you according. All you need to do is to place your quote with us and we will start working for you immediately. So how can your place a quote with us? This is simple, find us on and place your quote today. Our sales representatives and engineers work around the clock to ensure that they serve you best.