January 19, 2019

Manufacturing Capabilities – Technology

Manufacturing Capabilities – Technology of Rush PCB   Standard Advanced Emerging Layer Count 2-48 Layers 2-48 Layers 50+ Layers Laminate Materials       FR4 Tg […]
January 19, 2019

High Density Interconnection In Hole

HDI Technology in Hole High Density Interconnection Blind & Burried 9+2+9 Laser Drill Market Trend vs. Technology Solution HDI Process Flow Main Process of Build – […]
January 19, 2019

Flex and Rigid Hybrid Board

Flex + Rigid Hybrid Board FR4 & Polyimide Kapton Thick   Flexible Board Polyimide kapton   Blind & Burried 1+FLEX+1 Laser drill   Material:   Flex:L2~L3 TU-768:L1~L0 L0~L4 […]
January 19, 2019

Materials Stock

Materials Stock – Rush PCB Name Core Size Copper Panel Size R3003 0.02 H/H 24×18 R3006 0.005 H/H 24×18 R3006 0.003 H/H 24×18 R3006 0.025 H/H […]
December 20, 2018

PCB Bare Boards – 2 and 4 Layers

Get Fast and Quick Quote    Feel free to email us to get a quick free quote. sales@rushpcb.co.uk rushpcb.uk@gmail.com
December 20, 2018

Every Day Special – 10 pcs

Get Fast and Quick Quote    Feel free to email us to get a quick free quote. sales@rushpcb.co.uk rushpcb.uk@gmail.com
August 21, 2018

Free Instant Quote – Full Turnkey

August 21, 2018

Free Instant Quote – Assembly

June 18, 2018
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Integrity of the Signal in HDI Circuits

With rise-times of signals on the printed circuit boards (PCBs) continuing to drop, the age-old concerns related to signal integrity is always at the forefront of […]
October 29, 2015
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High Density Interconnect Printed Circuit Board (PCB)

The high density interconnects printed circuits board (PCB) is one of the latest and fast growing technologies in printed circuits board industry.  An HDI PCB is […]