High Density Interconnect Printed Circuit Board (PCB)
The high density interconnects printed circuits board (PCB) is one of the latest and fast growing technologies in printed circuits board industry. An HDI PCB is a printed circuit board with a higher wiring density per unit area compared to other types of printed circuit boards. They compose of finer line and spaces of less than or equal to 100 micrometer, a smaller vias of less than 150 micrometer, capture pads of less than 400 micrometer and higher connection pads density of more than 20 pads per centimeter square compared with other printed circuits board technologies. Moreover, they contain blind and or buried vias. RUSHPCB is your recommended PCB manufacturer; our quality is uniquely perfect. Please join us as we discuss the types of Higher Density Interconnect PCBs.
High Density Interconnect PCBs are of 6 types; through vias from surface to surface,two or more high density interconnects layer with through vias, with buried vias and through vias and passive substrate with no electrical connection. A microvia is a blind hole with a diameter of less than or equal to 150 micrometer and a pad diameter of less than or equal to 350 micrometer formed by either mechanical drilling or laser. The pictures below shows the high density interconnect printed circuit boards and a normal printed circuit board.
Type I 1(C) 0 or 1(C) 1HDI PCB
This type of HDI PCB has a single microvia layer on either one or both sides of the core which is manufactured by PWB technique. Its core can be multilayer, rigid or flex and uses both the plated microvias and plated through holes for interconnection purposes. It utilizes blind and not buried vias. On the construction part of it these types of High density interconnect printed circuit boards both the microvias and the conductive vias are used for the interconnection purposes. Thus a single microvias layer is fabricated on either one side if a PWB substrate core. The PWB substrate core is always manufactured using a conventional PWB technique and may be flexible or rigid. The substrate can have as few as one circuit layer or may be as complex as any number of inner layers.
Type II 1(C) 0 or 1(C) 1HDI PCB
This type of HDI PCB has a single microvia layer on either one or both sides of the core which is manufactured by PWB technique. Its core can be multilayer, rigid or flex and uses both the plated microvias and plated through holes for interconnection purposes. It utilizes both the blind and buried vias. The microvia process always increases the cost of high density interconnects printed circuits board but the proper design and reduction in layer count decreases the cost in material square inches and layer count more significantly. In their construction they have PTHs used for surface to surface interconnections. The buried vias may be filled with either the conductive or non-conductive paste, or rather be filled with dielectric material from lamination processes.
Type III 2>=(C)>=0HDI PCB
This type of high density interconnects printed circuits board has at least two layers of microvia on either one or both sides of the core which is manufactured by PWB technique. Its core can be multilayer, rigid or flex and uses both the plated microvias and plated through holes for interconnection purposes. It utilizes both the blind and buried vias. Just like the type II, the buried vias may be filled with either the conductive or non-conductive paste, or rather be filled with dielectric material from lamination processes. The only difference from type II is that the high density interconnect printed circuit boards has at least two microvias layers on at least one side of a substrate core. As for the typeIII with staggered microvias layer and a staggered vias, it utilized the PTH, staggered vias and microvias which is filled with conductive paste and other several high densities interconnect materials.
Type IV >=1(P)>=0HDI PCB
Has at least one layer microvias on either one or both sides of the core which is manufactured by PWB technique. Its core uses both the plated microvias and plated through holes for interconnection purposes and a passive core not electrically connected and used often for CTE management.It utilizes a micro via layer over an existing predrilled passive substrateand the additional micro via layers can be added in a sequential manner.
Type V coreless HDI HDI PCB
This type has thin cores which uses both plated microvias and conductive paste interconnections and also a B stage resins system prepreg where conductive material has been placed locally. The resins coated copper as a choice of material used provides ease to drill and a even surface for fine lines.There is no core essential to the construction of this type V high density interconnection since all layer pairs have the same characteristics. The construction of this type id majorly the fabrication of an even number of layers laminated together at the same time the interconnections are made between the odd and the even layers. Thus it is neither build up nor sequential, but a single lamination process. Their layer pairs are joined together using B-stage resin system. The external layers consist of single conductive layer, as long as its companion layer pair is on the opposite side.
Type VI constructions
This type of HDI PCBs comprises of a construction where connections are build up without normal plating but formed with conductive ink or other types of conductive materials. It uses the laser drillable prepreg as the major source of material which has high peel strength and high resin content, always cheap and has a longer shelf life. The layers may be formed sequentially or core laminated it is manufactured using piercing posts which are made up of conducting elements and attached to an unreinforced copper layer.
The high density interconnects printed circuits board are based on the advancement printed circuits board technology by miniaturization of components and semiconductors packages that supports advanced features in revolutionary new products such as 4G network communications and touchscreen computing. They are characterized by high density also laser microvias, fine lines and thin materials with high performance. Their increased density property enables them to perform more functions per unit area. They have multiple layers of copper filled stacked microvias which creates a structure that enables more complex interconnections. The complex interconnections structures enables necessary routing solutions for current pin out chips utilized in the mobile devices and other high technology products. As experts in the PCB world, we always ensure that our PCBs adhere to the customer specifications; whether HDI PCB or not. Please visit us at RUSH PCB Ltd. for any queries or to place your quote today. RUSHPCB will always remain to be the best PCB manufacturer if you work with us.